Iimveliso
Panasonic SMT Chip Mounter NPM-W2
Iimbonakalo
Imveliso ephezulu kunye nomgangatho ngokuprinta, ukubekwa kunye nokudibanisa inkqubo yokuhlolaNgokuxhomekeke kwi-PCB oyivelisayo, ungakhetha imowudi enesantya esiphezulu okanye imowudi yokuchaneka okuphezulu.
Kwiibhodi ezinkulu kunye namacandelo amakhuluPCBs ukuya kubukhulu be-750 x 550 mm kunye noluhlu lwecandelo ukuya kwi-L150 x W25 x T30 mm
Imveliso yendawo ephezulu ngokubekwa kwemizila emibiniKuxhomekeka kwi-PCB oyivelisayo, unokukhetha eyona ndlela ilungileyo yokubeka- "Imele" "Enye" okanye "Hybrid"
Ukufezekiswa ngaxeshanye kwimveliso yendawo ephezulu kunye nokubekwa ngokuchanekileyo okuphezulu
Imo yemveliso ephezulu (imowudi yemveliso ephezulu: IVULIWE)
Max.isantya: 77 000 cph * 1 (IPC9850 (1608): 59 200cph * 1 ) / ukuchaneka kokubekwa: ± 40 μm
Imowudi yokuchaneka okuphezulu (imowudi ephezulu yemveliso: OFF)
Max.isantya: 70 000 cph * 1 / Ukuchaneka kokubekwa: ± 30 μm (Ukhetho: ± 25μm * 2)
*1:I-Tact ye-16NH × 2 intloko*2:Phantsi kweemeko ezichazwe yi-PSFS
Intloko entsha yokubeka
 | I-Lightweight 16-nozzle intloko |
Isiseko esitsha sokuqina okuphezulu
· Isiseko esiqinileyo esixhasa ukubekwa kwesantya esiphezulu / ukuchaneka
Ikhamera yokuqaphela ezininzi
· Imisebenzi emithathu yokuqaphela idityaniswe kwikhamera enye
· Ukuqaphela ukuskena okukhawulezileyo kuquka ukubhaqwa kobude bamacandelo
· Iphuculwe ukusuka kwi-2D ukuya kwi-3D yenkcazo
Uqwalaselo lomatshini
Ngasemva kunye noYilo lweFeeder yangaphambili
 | Amacandelo angama-60 ahlukeneyo angaxhonywa ukusuka kwi-16mm tape feeders. |
Uyilo lweTreyi enye
I-13 yeendawo zokubeka ukutya okuzinzileyo ziyafumaneka.Ukunyuswa kwetreyi yePoP kuyenzeka ngeyunithi yodluliselo.
I-Twin Tray Layout
Ngelixa itreyi enye isetyenziselwa ukuvelisa, enye itreyi ingasetyenziselwa ukuseta imveliso elandelayo kwangethuba.
Ukusebenza okuninzi
Ibhodi enkulu
Imiba yendlela enye (Ukhetho oluthile.)
Ibhodi enkulu ukuya kuma-750 x 550 mm ingaphathwa
Imiba yeendlela ezimbini (Inkcazo yoKhetho.)
Iibhodi ezinkulu (750 x 260 mm) zinokuphathwa ngokudibeneyo.
Amacandelo amakhulu
Iyahambelana nobukhulu becandelo ukuya kuthi ga kwi-150 x 25 mm
Ukubekwa kwe-LED
Ukugqama Binning
Kuphephe ukuxutywa kokuqaqamba kwaye unciphise icandelo kunye nokulahlwa kwebhloko. Ukubeka esweni ukubalwa kwecandelo eliseleyo ukuphepha ukukhupha icandelo ngexesha lokusebenza.
*Nceda usibuze imilomo exhasa izinto ze-LED zeemilo ezahlukeneyo
Eminye imisebenzi
· Umsebenzi wokwaziwa kwamanqaku amabi kwihlabathi
· I-PCB yokulinda phakathi koomatshini (kunye neconveyor eyandisiweyo encanyathiselwe)Yehlisa ixesha lokutshintsha iPCB (750 mm)
Imveliso ephezulu-Isebenzisa indlela yokuxhoma kabini
Indawo engenye, eZimeleyo kunye neHybrid
Ukukhetha "Enye" kunye "Ezimeleyo" indlela yokubeka kabini ikuvumela ukuba usebenzise kakuhle inzuzo nganye.
Enye indlela : Iintloko zangaphambili nezingasemva zenza ukubekwa kwiiPCB ngaphambili nangasemva iindlela ngokutshintshanayo.
Ukuzimela : Intloko yangaphambili yenza ukubekwa kwi-PCB kwindlela yangaphambili kunye nentloko yangasemva iphumeze ukubekwa kwindlela yangasemva.
Ukutshintsha okuzimeleyo
Kwimo ezimeleyo, unokuqhuba utshintsho kwindlela enye ngelixa imveliso iqhubeka kwelinye lane.Ungatshintshisa inqwelo yokutya ngexesha lokuvelisa kwakhona kunye neyunithi yokutshintsha eZimeleyo (ukhetho).Ixhasa ukutshintshwa kwephini yenkxaso ngokuzenzekelayo (ukhetho) kunye nokutshintsha okuzenzekelayo (ukhetho) ukwenzela ukuba inike utshintsho olungcono kakhulu kuhlobo lwakho lwemveliso.
PCB ukuncitshiswa kwexesha exchange
Ii-PCB ezimbini zinokubotshwa kwinqanaba elinye (ubude bePCB: 350 mm okanye ngaphantsi) .Kwaye imveliso ephezulu inokuqondwa ngokunciphisa ixesha lokutshintshiselana kwePCB.
Ukutshintshwa okuzenzekelayo kwezikhonkwane zenkxaso (ukhetho)
Ukutshintsha kwesikhundla ngokuzenzekela kwizikhonkwane zenkxaso ukwenza utshintsho olungayekiyo kunye nokunceda ukugcina amandla omntu kunye neempazamo zokusebenza.
Ukuphuculwa komgangatho
Umsebenzi wokulawula ukuphakama kokubekwa
Ngokusekwe kwidatha yemeko ye-warpage ye-PCB kunye nedatha yobuninzi becandelo ngalinye eliza kubekwa, ulawulo lobude bokubekwa lulungiselelwe ukuphucula umgangatho wokunyuka.
Ukuphuculwa kwezinga lokusebenza
Indawo yokondla simahla
Ngaphakathi kwetheyibhile enye, iifidi zinokusetwa naphi na.Ulwabiwo olulolunye kunye nokusetwa kwe feeder ezintsha kwimveliso elandelayo inokwenziwa ngelixa umatshini esebenza.
I-feeders iya kufuna igalelo ledatha engaxhunyiwe kwi-intanethi ngesikhululo senkxaso (ukhetho).
Uhlolo lweSolder (SPI) ・ Uhlolo lweCandelo (AOI) – Intloko yohlolo
Ukuhlolwa kweSolder
· Ukuhlolwa kwembonakalo yesolder
UHlolo lwecandelo elinyusiweyo
· Ukuhlolwa kwenkangeleko yamalungu axhonyiweyo
Ukunyuswa kwangaphambili kwento yangaphandle*1 uhlolo
· Ukuhlolwa kwangaphambili kwezinto zangaphandle kwii-BGAs
· Ukuhlolwa kwento yangaphandle phambi kokubekwa kwetyala elitywiniweyo
*1: Into yangaphandle iyafumaneka kumacandelo etshiphu.
I-SPI kunye ne-AOI yokutshintsha okuzenzekelayo
· Ukuhlolwa kwe-Solder kunye necandelo liguqulwa ngokuzenzekelayo ngokwedatha yemveliso.
Ukuhlanganiswa kwedatha yokuhlola kunye nokubekwa
· Ithala leencwadi lecandelo elilawulwa kumbindi okanye ulungelelwaniso lwedatha alufuni kulondolozwa kwedatha ezimbini kwinkqubo nganye.
Ikhonkco elizenzekelayo kulwazi olusemgangathweni
· Ulwazi oludityanisiweyo oluzenzekelayo lwenkqubo nganye lunceda uhlalutyo lwesizathu sakho sesiphene.
I-Adhesive Dispensing - Intloko yokukhupha
Indlela yokukhupha i-Screw-type
· I-NPM ye-Panasonic inomatshini oqhelekileyo wokukhupha we-HDF, oqinisekisa ukunikezelwa komgangatho ophezulu.
Ixhasa iipateni ezahlukeneyo zokukhupha amachaphaza/umzobo
· Isivamvo sokuchaneka okuphezulu (ukhetho) silinganisa ubude bePCB yendawo ukulinganisa ubude bokuhambisa, okuvumela ukukhupha okungadibanisi kwi-PCB.
Ukunamathela kwi-self-Alignment
Uluhlu lwethu lwe-ADE 400D luyi-high-temperature ephilisa i-SMD yokubambelela kunye ne-self-alignment yecandelo elihle.
Emva kokuba i-solder inyibilika, ukuzilungelelanisa kunye nokucwila kwecandelo kwenzeka.
Ukubekwa komgangatho ophezulu - inkqubo ye-APC
Ilawula iiyantlukwano kwi-PCBs kunye namacandelo, njl njl kwisiseko somgca ukufikelela kwimveliso esemgangathweni.
APC-FB*1 Ingxelo kumatshini wokushicilela
· Ngokusekelwe kwidatha yokulinganisa ehlalutyiweyo evela kuhlolo lwe-solder, ilungisa iindawo zokuprinta.(X,Y,θ)
APC-FF*1 Feedforward kumatshini wokubekwa
· Ihlalutya idatha yokulinganisa indawo ye-solder, kwaye ilungisa iindawo zokubeka icandelo (X, Y, θ) ngokufanelekileyo.Izixhobo zeChip (0402C/R ~)Ipakeji yecandelo (QFP, BGA, CSP)
I-APC-MFB2 Feedforward kwi-AOI /Impendulo kumatshini wokubekwa
· Ukuhlolwa kwendawo kwi-APC offset position
· Inkqubo ihlalutya idatha yomlinganiselo wecandelo le-AOI, ilungisa indawo yokubeka (X, Y, θ) , kwaye ngaloo ndlela igcina ukuchaneka kokubeka.Ihambelana namacandelo e-chip, amacandelo e-electrode asezantsi kunye namacandelo okukhokela*2
*1 : I-APC-FB (impendulo) /FF (i-feedfor) : Umatshini wokuhlola we-3D wenye inkampani unokudityaniswa.(Nceda ubuze ummeli wakho wasekuhlaleni wentengiso ngeenkcukacha.)*2 : APC-MFB2 (i-mounter feedback2) : Iintlobo zecandelo elisebenzayo ziyahluka ukusuka kumthengisi we-AOI ukuya komnye.(Nceda ubuze ummeli wakho wentengiso wengingqi ngeenkcukacha.)
Inketho yoQinisekiso lwecandelo -Isikhululo senkxaso sokuseta ngaphandle kwe-intanethi
Ithintela iimpazamo zokuseta ngexesha lotshintsho Ibonelela ngokwanda kokusebenza kwemveliso ngokusebenza lula
*Iiskena ezingenazingcingo kunye nezinye izincedisi ziya kubonelelwa ngabathengi
· Ithintele ngokungxamisekileyo ukubekwa kwelungu kwindawo engafanelekanga.
· Useto oluzenzekelayo longqamaniso lwedathaUmatshini ngokwawo uyaqinisekisa, esusa isidingo sokukhetha idatha yokuseta eyahlukileyo.
· Umsebenzi we-InterlockNaziphi na iingxaki okanye ukuphelelwa kukuqinisekiswa kuya kumisa umatshini.
· Umsebenzi wokukhangelaUmsebenzi wokukhangela ukwenza inkqubo yokuqinisekisa icace ngakumbi.
Ngezikhululo zenkxaso, ukusetwa kwenqwelo ye-feeder ngaphandle kweintanethi kunokwenzeka nangaphandle komgangatho wokuvelisa.
• Iintlobo ezimbini zeZitishi zeNkxaso ziyafumaneka.
Ikhono lokutshintsha-Ukhetho lokutshintsha oluzenzekelayo
Ukuxhasa utshintsho (idatha yemveliso kunye nokulungiswa kobubanzi bomzila) kunokunciphisa ukulahlekelwa kwexesha
• I-ID ye-PCB yokufunda-ngohlobo lomsebenzi wokufunda-ngaphakathi we-PCB uyakhetheka phakathi kweentlobo ezi-3 zeskena sangaphandle, ikhamera yentloko okanye ifom yokucwangcisa.
Ikhono lokutshintsha-Ukhetho lokuseta i-Fieder navigator
Sisixhobo senkxaso ukuhamba ngenkqubo yokuseta ngokufanelekileyo.Izixhobo zesixhobo kwinani lexesha elithathayo ukwenza kunye nokugqiba imisebenzi yokumisela xa kuqikelelwa ixesha elifunekayo kwimveliso kunye nokubonelela umqhubi imiyalelo yokumisela.Oku kuya kubona kwaye kuhlanjululwe imisebenzi yokucwangcisa ngexesha lokusekwa komgca wokuvelisa.
Ukuphuculwa kwezinga lokusebenza - Amacandelo anikezela ukhetho lomqhubi
Isixhobo senkxaso sobonelelo lwecandelo esijonga izinto eziphambili ngokubonelela ngecandelo.Iqwalasela ixesha elishiyekileyo de kuphele icandelo kunye nendlela esebenzayo yokunyakaza komsebenzisi ukuthumela imiyalelo yonikezelo lwecandelo kumsebenzisi ngamnye.Oku kuphumeza unikezelo lwecandelo olusebenzayo.
*I-PanaCIM iyadingeka ukuba ibe nabaqhubi abajongene nokubonelela ngamacandelo kwimigca emininzi yokuvelisa.
PCB ulwazi unxibelelwano umsebenzi
Ulwazi loqwalaselo lwamanqaku olwenziwe kumatshini wokuqala we-NPM emgceni lugqithiselwa koomatshini be-NPM abasezantsi. Okunokunciphisa ixesha lomjikelo kusetyenziswa ulwazi olukhutshelweyo.
Inkqubo yokuDala iDatha – NPM-DGS (Imodeli No.NM-EJS9A)
Iphakheji yesoftware inceda ukufezekisa imveliso ephezulu ngolawulo oludibeneyo lwendalo, ukuhlela kunye nokulinganisa idatha yemveliso kunye nethala leencwadi.
*1:Ikhompyutha kufuneka ithengwe ngokwahlukeneyo.*2:NPM-DGS inemisebenzi emibini yolawulo yomgangatho kunye nomgangatho womgca.
Ukungeniswa kwe-Multi-CAD
Phantse yonke idatha yeCAD inokufunyanwa ngokubhaliswa kwenkcazo enkulu.Iipropati, ezifana ne-polarity, nazo zinokuqinisekiswa kwisikrini kwangaphambili.
Ukulinganisa
Ukulinganisa ngobuchule kunokuqinisekiswa kwiscreen kwangethuba ukuze umlinganiselo wokusebenza weline unyuke.
Umhleli wePPD
Ngokuqulunqa ngokukhawuleza nangokulula ukubekwa kunye nedatha yentloko yokuhlola kwisibonisi sePC ngexesha lokusebenza, ukulahleka kwexesha kunokuncitshiswa.
Ithala leencwadi
Ilayibrari yecandelo labo bonke oomatshini bokubekwa kubandakanya uthotho lweCM kumgangatho inokubhaliswa ukudibanisa ulawulo lwedatha.
Hlanganisa iSetter Job (MJS)
Ukulungiswa kwedatha yemveliso kuvumela i-NPM-D2 ukuba ilungiselele ngokuqhelekileyo i-feeders.Ukunciphisa ixesha lokutshintshwa kwe-Feeder yokutshintsha kunokuphucula imveliso.
Ukwenziwa kwedatha yecandelo ngaphandle kwe-intanethiukhetho
Ngokudala idatha yecandelo elingekho kwi-intanethi usebenzisa iskena esithengiweyo evenkileni, imveliso kunye nomgangatho unokuphuculwa.
Inkqubo yokuDala iDatha-Iyunithi yeKhamera engaxhunyiwe kwi-intanethi (ukhetho)
Ukunciphisa ixesha kumatshini ukulungiselela iinxalenye zenkqubo yethala leencwadi kwaye uncedise ukufumaneka kwezixhobo kunye nomgangatho.
Idatha yethala leencwadi yecandelo yenziwe kusetyenziswa umgca wekhameraIimeko ezingenzekiyo kwiskena ezifana neemeko zoKhanya, kunye nezantya zokuqondwa, zinokujongwa ngaphandle kweintanethi kuqinisekiswa uphuculo lomgangatho kunye nokufumaneka kwezixhobo.
Ukuphuculwa komgangatho-Umbukeli wolwazi olusemgangathweni
Le yisoftware eyilelwe ukuxhasa ukuqondwa kwamanqaku atshintshayo kunye nohlalutyo lwemiba yesiphene ngokuboniswa kolwazi olunxulumene nomgangatho (umzekelo, izikhundla ze-feeder ezisetyenzisiweyo, ukuqondwa kwamaxabiso e-offset kunye nedatha yamacandelo) nge-PCB nganye okanye indawo yokubeka.Kwimeko yentloko yethu yokuhlola yaziswa, iindawo zesiphene zingabonakaliswa ngokubambisana nolwazi olunxulumene nomgangatho
*IPC iyafuneka kuwo wonke umgca.
Umgangatho wefestile yomjongi wolwazi
Umzekelo wokusetyenziswa kombukeli wolwazi olusemgangathweni
Uchonga i-feeder esetyenziselwa ukunyuswa kweebhodi zeesekethe ezineziphene.Kwaye ukuba, umzekelo, unezinto ezininzi ezingalunganga emva kokudibanisa, izinto eziphosakeleyo zingathathwa ngokuba zibangelwa;
Iimpazamo ze-1.splicing (ukutenxa kwi-pitch kutyhilwa ngokuqatshelwa kwe-offset values)
2.utshintsho kwimilo yecandelo (iindawo ezingalunganga zereel okanye abathengisi)
Ngoko unokuthatha inyathelo elikhawulezayo kwisilungiso esingalunganga.
Inkcazo
| Isazisi somzekelo | NPM-W2 | |||||
| Intloko yangasemva Intloko engaphambili | I-Lightweight16-nozzle intloko | Intloko ye-12-nozzle | Intloko ye-Lightweight8-nozzle | 3-nozzle intloko V2 | Intloko ekhuphayo | Akukho ntloko |
| I-Lightweight 16-nozzle intloko | NM-EJM7D | NM-EJM7D-MD | NM-EJM7D | |||
| Intloko ye-12-nozzle | NM-EJM7D-MD | |||||
| I-Lightweight 8-nozzle intloko | ||||||
| 3-nozzle intloko V2 | ||||||
| Intloko ekhuphayo | NM-EJM7D-MD | NM-EJM7D-D | ||||
| Intloko yokuhlola | NM-EJM7D-MA | NM-EJM7D-A | ||||
| Akukho ntloko | NM-EJM7D | NM-EJM7D-D | ||||
| PCB imilinganiselo(mm) | Indlela enye*1 | Ukunyuswa kwebhetshi | L 50 x W 50 ~ L 750 x W 550 |
| Ukufakwa kwe-2-positin | L 50 x W 50 ~ L 350 x W 550 | ||
| Iindlela ezimbini*1 | Utshintshiselwano kabini (Iqela) | L 50 × W 50 ~ L 750 × W 260 | |
| Ukudluliselwa kabini (2-positin) | L 50 × W 50 ~ L 350 × W 260 | ||
| Utshintshiselwano olunye (Iqela) | L 50 × W 50 ~ L 750 × W 510 | ||
| Utshintshelo olunye (2-positin) | L 50 × W 50 ~ L 350 × W 510 | ||
| Umthombo wombane | Isigaba se-3 AC 200, 220, 380, 400, 420, 480 V 2.8 kVA | ||
| Umthombo womoya *2 | 0.5 MPa, 200 L / min (ANR) | ||
| Imilinganiselo *2 (mm) | W 1 280*3 × D 2 332 *4 × H 1 444 *5 | ||
| IMisa | 2 470 kg (Yomzimba ongundoqo kuphela : Oku kohluka ngokuxhomekeke kuqwalaselo lokhetho.) | ||
| Intloko yokubeka | Ikhaphukhaphu 16-intloko yenozzle (intloko nganye) | Intloko yemilomo eyi-12 (intloko nganye) | Ikhaphukhaphu 8-intloko yenozzle (intloko nganye) | 3-nozzle intloko V2(intloko nganye) | |||
| Imowudi yemveliso ephezulu[ON] | Imowudi yemveliso ephezulu[OFF] | Imowudi yemveliso ephezulu[ON] | Imowudi yemveliso ephezulu[OFF] | ||||
| Max.uchama | 38 500cph(0.094 s/ itshiphu) | 35 000cph(0.103 s/ itshiphu) | 32 250cph(0.112 s/ itshiphu) | 31 250cph(0.115 s/ itshiphu) | 20 800cph(0.173 s/ itshiphu) | 8 320cph(0.433 s/ chip)6 500cph(0.554 s/ QFP) | |
| Ukuchaneka kokubekwa(Cpk □1) | ± 40 μm / itshiphu | ± 30 μm / itshiphu (±25μm / itshiphu)*6 | ± 40 μm / itshiphu | ± 30 μm / itshiphu | ± 30 µm/chip± 30 µm/QFP □12mm ukuya □ □32mm± 50 µm/QFP □12mm Ngaphantsi | ± 30 µm/QFP | |
| Amacandelo (mm) | 0402*7 itshiphu ~ L 6 x W 6 x T 3 | 03015*7 *8/0402*7 itshiphu ~ L 6 x W 6 x T 3 | 0402*7 itshiphu ~ L 12 x W 12 x T 6.5 | 0402*7 itshiphu ~ L 32 x W 32 x T 12 | 0603 itshiphu ukuya L 150 x W 25 (diagonal152) x T 30 | ||
| Unikezelo lwamacandelo | Ukucofa | Tape: 4/8/12/16/24/32/44/56 mm | Tape: 4 ukuba 56 mm | inkawu : 4 ukuba 56 / 72 / 88 / 104 mm | |||
| Ubukhulu.120 (Itheyiphu: 4, 8 mm) | Imiba yenqwelo yangaphambili/ngemva yenqola yesondlo : Max.120( Ububanzi beTape kunye ne-feed zixhomekeke kwimiqathango esekhohlo)Ubalulo lwetreyi enye : Max.86( Ububanzi beTape kunye ne-feed ziphantsi kwemiqathango esekhohlo)Iinkcukacha zetreyi ezingamawele : Ubukhulu .60( Ububanzi beTape kunye ne-feeder zixhomekeke kwimiqathango esekhohlo) | ||||||
| Intonga | Imiba yenqwelo yangaphambili/engasemva ye-feeder :Ubukhulu | ||||||
| Itreyi | Iimpawu zetreyi enye : Max.20Twin iinkcukacha zetreyi : Max.40 | ||||||
| Intloko ekhuphayo | Ukukhupha amachaphaza | Zoba ukukhupha |
| Isantya sokuhambisa | 0.16 s/dot (Imeko : XY=10 mm, Z=ngaphantsi kwe-4 mm intshukumo, Akukho θ ukujikeleza | 4.25 s/icandelo (Umqathango : 30 mm x 30 mm kwikona yokukhupha)*9 |
| Ukuchaneka kwendawo yokuncamathela (Cpk □1) | ± 75 μ m / ichaphaza | ± 100 μ m /icandelo |
| Amacandelo asebenzayo | 1608 chip ukuya SOP, PLCC, QFP, Isidibanisi, BGA, CSP | BGA, CSP |
| Intloko yokuhlola | Intloko yokuhlola ye-2D (A) | Intloko yokuhlola ye-2D (B) | |
| Isigqibo | 18µm | 9µm | |
| Jonga ubukhulu (mm) | 44.4 x 37.2 | 21.1 x 17.6 | |
| Ixesha lokwenziwa kohlolo | Uhlolo lweSolder *10 | 0.35s/ Jonga ubukhulu | |
| Ukuhlolwa kweCandelo *10 | 0.5s/ Jonga ubukhulu | ||
| Into yokuhlola | Uhlolo lweSolder *10 | IChip component : 100 μm × 150 μm okanye ngaphezulu (0603 okanye ngaphezulu)Ipakethe yecandelo : φ150 μm okanye ngaphezulu | iChip component : 80 μm × 120 μm okanye ngaphezulu (0402 okanye ngaphezulu)Ipakethe yecandelo : φ120 μm okanye ngaphezulu |
| Ukuhlolwa kweCandelo *10 | I-square chip (0603 okanye ngaphezulu), i-SOP, i-QFP (i-pitch ye-0.4mm okanye ngaphezulu), i-CSP, i-BGA, i-Aluminiyam i-electrolysis capacitor, i-Volume, i-Trimmer, i-Coil, i-Connector * 11 | I-Square chip (0402 okanye ngaphezulu), i-SOP, i-QFP (i-pitch ye-0.3mm okanye ngaphezulu), i-CSP, i-BGA, i-Aluminiyam i-electrolysis capacitor, i-Volume, i-Trimmer, i-Coil, i-Connector * 11 | |
| Izinto zokuhlola | Uhlolo lweSolder *10 | Ukugungqa, ukufiphala, ukungahambi kakuhle, imilo engaqhelekanga, ukuvala ibhulorho | |
| Ukuhlolwa kweCandelo *10 | Ulahlekile, tshintsha, ukuphaphatheka, ipolarity, uhlolo lwento yangaphandle *12 | ||
| Ukuchaneka kwendawo yokuhlola *13( Cpk □1) | ± 20 μm | ± 10 μm | |
| Inani lokuhlola | Uhlolo lweSolder *10 | Max.30 000 iipcs./machine (Inani lamacandelo: Ubuninzi. 10 000 pcs./machine) | |
| Ukuhlolwa kweCandelo *10 | Max.10 000 iipcs./umatshini | ||
| *1 | : | Nceda uqhagamshelane nathi ngokwahlukeneyo ukuba ungayiqhagamshela kwi-NPM-D3/D2/D.Ayinakuqhagamshelwa kwi-NPM-TT kunye ne-NPM. |
| *2 | : | Kuphela kumzimba oyintloko |
| *3 | : | I-1 880 mm ububanzi ukuba ii-conveyors ezandisiweyo (300 mm) zibekwe kumacala omabini. |
| *4 | : | Umyinge D uquka i-tray feeder : 2 570 mmDimension D iquka inqwelo yesondlo : 2 465 mm |
| *5 | : | Ngaphandle kwemonitha, inqaba yomqondiso kunye nesigqubuthelo sefeni yesilingi. |
| *6 | : | ±25 μm ukhetho lwenkxaso yokubeka.(Phantsi kweemeko ezichazwe yiPSFS) |
| *7 | : | I-chip ye-03015/0402 ifuna umbhobho/isondlo esithile. |
| *8 | : | Inkxaso yokubekwa kwetshiphu ye-03015 mm iyakhethwa.(Phantsi kweemeko ezichazwe yi-PSFS: Ukuchaneka kokubeka ±30 μm / chip) |
| *9 | : | Ixesha lokulinganisa ubude be-PCB le-0.5s lifakiwe. |
| *10 | : | Intloko enye ayikwazi ukuphatha ukuhlolwa kwe-solder kunye nokuhlolwa kwecandelo ngexesha elifanayo. |
| *11 | : | Nceda ujonge incwadana yengcaciso ngeenkcukacha. |
| *12 | : | Into yangaphandle iyafumaneka kumalungu etshiphu.(Ngaphandle kwetshiphu ye-03015 mm) |
| *13 | : | Oku kukuchaneka kwendawo yokuhlola i-solder elinganiswa ngereferensi yethu usebenzisa i-PCB yeglasi yethu yokulinganisa indiza.Isenokuchatshazelwa lutshintsho ngesiquphe lobushushu be-ambient. |
*Ukubeka ixesha lobuchule, ixesha lokuhlola kunye namaxabiso achanekileyo anokwahluka kancinane ngokuxhomekeke kwiimeko.
*Nceda ujonge incwadana eneenkcukacha malunga neenkcukacha.
Hot Tags: panasonic smt chip mounter npm-w2, china,abavelisi, ababoneleli, ihoseyili, thenga,fektri
