Ihoseyili yePanasonic SMT Chip Mounter NPM-D3 uMvelisi kunye noMboneleli |SFG
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Iimveliso

Panasonic SMT Chip Mounter NPM-D3

Inkcazelo emfutshane:

Imveliso exutywe kunye neentlobo ezahlukeneyo ze-substrates kumgca ofanayo nazo zibonelelwa nge-conveyor ezimbini.


Iinkcukacha zeMveliso

Iithegi zeMveliso

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Uphawu

Imveliso yendawo ephezulu enemigca yokuxhoma iyonkeImveliso ephezulu kunye nomgangatho ngoshicilelo, ukubekwa kunye nokudibanisa inkqubo yokuhlola

Iimodyuli ezilungisekayo zivumela ukusetwa komgca oguquguqukayoIntloko yendawo bhetyebhetye kunye nemisebenzi yeplug-and-play.

Ulawulo olubanzi lwemigca, umgangatho kunye nefektri kunye nenkqubo yesoftwareInkxaso yesicwangciso sokuvelisa ngokubeka iliso ekusebenzeni komgca.

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Isicombululo seTotal Line

Imigca yemodyuli emincinci emincinci ngokufaka iintloko zokuhlola

Ibonelela ngemveliso ekumgangatho ophezulu kunye nokuhlolwa kwe-line

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*1:PCB traverser conveyor izakulungiselelwa ngumthengi.*2:Nceda uqhagamshelane nommeli wakho wentengiso kubashicileli abahambelanayo kunye neenkcukacha ezithe vetshe.

Umgca weMveliso emininzi

Imveliso exutywe kunye neentlobo ezahlukeneyo ze-substrates kumgca ofanayo nazo zibonelelwa nge-conveyor ezimbini.

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Ukufezekiswa ngaxeshanye kwimveliso yendawo ephezulu kunye nokubekwa ngokuchanekileyo okuphezulu

Imowudi yemveliso ephezulu (imowudi yemveliso ephezulu: ON

Max.isantya: 84 000 cph * 1 (IPC9850 (1608): 63 300cph * 1 )/ Ukuchaneka kokubekwa: ± 40 μm

Imowudi yokuchaneka okuphezulu (imowudi yemveliso ephezulu: OFF

Max.isantya: 76 000 cph * 1 / Ukuchaneka kokubekwa: ± 30 μm (Ukhetho: ± 25μm * 2)

* 1: I-Tact ye-16NH × 2 intloko * 2: Ngaphantsi kweemeko ezichazwe yiPanasonic

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Intloko entsha yokubeka

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I-Lightweight 16-nozzle intloko

Isiseko esitsha sokuqina okuphezulu

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Isiseko esiqinileyo esixhasa ukubekwa kwesantya esiphezulu / ukuchaneka

Ikhamera yokuqaphela ezininzi

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· Imisebenzi emithathu yokuqaphela idityaniswe kwikhamera enye

· Ukuqaphela ukuskena okukhawulezileyo kuquka ukubhaqwa kobude bamacandelo

· Iphuculwe ukusuka kwi-2D ukuya kwi-3D yenkcazo

Imveliso ephezulu-Isebenzisa indlela yokuxhoma kabini

Indawo engenye, eZimeleyo kunye neHybrid

Ukukhetha "Enye" kunye "Ezimeleyo" indlela yokubeka kabini ikuvumela ukuba usebenzise kakuhle inzuzo nganye.

• Enye indlela :

Iintloko zangaphambili nezingasemva zenza ukubekwa kwiiPCBs ngaphambili nangasemva iindlela.

• Ukuzimela :

Intloko yangaphambili yenza ukubekwa kwi-PCB kwilayini yangaphambili kunye nentloko yangasemva yenza ukubekwa kwindlela yangasemva.

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Imveliso ephezulu ngokubekwa ngokuzimeleyo ngokupheleleyo

Ukubekwa ngokuzimeleyo kwamacandelo e-tray ngokudibanisa ngokuthe ngqo ne-NPM-TT (TT2) .Ikwazi ukubekwa ngokuzimeleyo ngokupheleleyo kwamacandelo e-tray ukuphucula ixesha lokujikeleza kwe-middle-, enkulu-ubungakanani becandelo lokubekwa kwecandelo kunye nentloko ye-3-nozzle.Isiphumo somgca wonke siphuculwe.

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PCB ukuncitshiswa kwexesha exchange

Vumela i-PCB yokulinda engaphantsi kwe-L=250mm* kumhambisi ohamba phezulu ngaphakathi kumatshini ukunciphisa ixesha lokutshintshiselana kwe-PCB kunye nokuphucula imveliso.

*Xa ukhetha izihambisi ezimfutshane

Ukutshintshwa okuzenzekelayo kwezikhonkwane zenkxaso (ukhetho)

Ukutshintsha kwesikhundla ngokuzenzekela kwizikhonkwane zenkxaso ukwenza utshintsho olungayekiyo kunye nokunceda ukugcina amandla omntu kunye neempazamo zokusebenza.

Ukuphuculwa komgangatho

Umsebenzi wokulawula ukuphakama kokubekwa

Ngokusekwe kwidatha yemeko ye-warpage ye-PCB kunye nedatha yobuninzi becandelo ngalinye eliza kubekwa, ulawulo lobude bokubekwa lulungiselelwe ukuphucula umgangatho wokunyuka.

Ukuphuculwa kwezinga lokusebenza

Indawo yokondla simahla

Ngaphakathi kwetheyibhile enye, iifidi zinokusetwa naphi na.Ulwabiwo olulolunye kunye nokusetwa kwe feeder ezintsha kwimveliso elandelayo inokwenziwa ngelixa umatshini esebenza.

I-feeders iya kufuna igalelo ledatha engaxhunyiwe kwi-intanethi ngesikhululo senkxaso (ukhetho).

Uhlolo lweSolder (SPI) • Uhlolo lweCandelo (AOI) – Intloko yohlolo

Ukuhlolwa kweSolder

· Ukuhlolwa kwembonakalo yesolder

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UHlolo lwecandelo elinyusiweyo

· Ukuhlolwa kwenkangeleko yamalungu axhonyiweyo

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Ukunyuswa kwangaphambili kwento yangaphandle*1 uhlolo

· Ukuhlolwa kwangaphambili kwezinto zangaphandle kwii-BGAs

· Ukuhlolwa kwento yangaphandle phambi kokubekwa kwetyala elitywiniweyo

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*1: Yenzelwe amacandelo etshiphu (ngaphandle kwetshiphu ye-03015 mm).

I-SPI kunye ne-AOI yokutshintsha okuzenzekelayo

· Ukuhlolwa kwe-Solder kunye necandelo liguqulwa ngokuzenzekelayo ngokwedatha yemveliso.

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Ukuhlanganiswa kwedatha yokuhlola kunye nokubekwa

· Ithala leencwadi lecandelo elilawulwa kumbindi okanye ulungelelwaniso lwedatha alufuni kulondolozwa kwedatha ezimbini kwinkqubo nganye.

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Ikhonkco elizenzekelayo kulwazi olusemgangathweni

· Ulwazi oludityanisiweyo oluzenzekelayo lwenkqubo nganye lunceda uhlalutyo lwesizathu sakho sesiphene.

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I-Adhesive Dispensing - Intloko yokukhupha

Indlela yokukhupha i-Screw-type

· I-NPM ye-Panasonic inomatshini oqhelekileyo wokukhupha we-HDF, oqinisekisa ukunikezelwa komgangatho ophezulu.

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Ixhasa iipateni ezahlukeneyo zokukhupha amachaphaza/umzobo1

· Isivamvo sokuchaneka okuphezulu (ukhetho) silinganisa ubude bePCB yendawo ukulinganisa ubude bokuhambisa, okuvumela ukukhupha okungadibanisi kwi-PCB.

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Ukubekwa komgangatho ophezulu - inkqubo ye-APC

Ilawula iiyantlukwano kwi-PCBs kunye namacandelo, njl njl kwisiseko somgca ukufikelela kwimveliso esemgangathweni.

APC-FB*1 Ingxelo kumatshini wokushicilela

● Ngokusekelwe kwidatha yokulinganisa ehlalutyiweyo evela kuhlolo lwe-solder, ilungisa iindawo zokuprinta.(X,Y,θ)

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APC-FF*1 Feedforward kumatshini wokubekwa

· Ihlalutya idatha yokulinganisa indawo ye-solder, kwaye ilungisa iindawo zokubeka icandelo (X, Y, θ) ngokufanelekileyo.Izixhobo zeChip (0402C/R ~)Ipakeji yecandelo (QFP, BGA, CSP)

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I-APC-MFB2 Feedforward kwi-AOI /Impendulo kumatshini wokubekwa

· Ukuhlolwa kwendawo kwi-APC offset position

· Inkqubo ihlalutya idatha yomlinganiselo wecandelo le-AOI, ilungisa indawo yokubeka (X, Y, θ) , kwaye ngaloo ndlela igcina ukuchaneka kokubeka.Ihambelana namacandelo e-chip, amacandelo e-electrode asezantsi kunye namacandelo okukhokela*2

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*1 : I-APC-FB (impendulo) /FF (i-feedfor) : Umatshini wokuhlola we-3D wenye inkampani unokudityaniswa.(Nceda ubuze ummeli wakho wasekuhlaleni wentengiso ngeenkcukacha.)*2 : APC-MFB2 (i-mounter feedback2) : Iintlobo zecandelo elisebenzayo ziyahluka ukusuka kumthengisi we-AOI ukuya komnye.(Nceda ubuze ummeli wakho wentengiso wengingqi ngeenkcukacha.)

Inketho yoQinisekiso lwecandelo -Isikhululo senkxaso sokuseta ngaphandle kwe-intanethi

Ithintela iimpazamo zokuseta ngexesha lotshintsho Ibonelela ngokwanda kokusebenza kwemveliso ngokusebenza lula

*Iiskena ezingenazingcingo kunye nezinye izincedisi ziya kubonelelwa ngabathengi

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· Ithintele ngokungxamisekileyo ukubekwa kwelungu kwindawo engafanelekanga.

· Useto oluzenzekelayo longqamaniso lwedathaUmatshini ngokwawo uyaqinisekisa, esusa isidingo sokukhetha idatha yokuseta eyahlukileyo.

· Umsebenzi we-InterlockNaziphi na iingxaki okanye ukuphelelwa kukuqinisekiswa kuya kumisa umatshini.

· Umsebenzi wokukhangelaUmsebenzi wokukhangela ukwenza inkqubo yokuqinisekisa icace ngakumbi.

Ngezikhululo zenkxaso, ukusetwa kwenqwelo ye-feeder ngaphandle kweintanethi kunokwenzeka nangaphandle komgangatho wokuvelisa.

· Iintlobo ezimbini zeZikhululo zeNkxaso ziyafumaneka.

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Ikhono lokutshintsha-Ukhetho lokutshintsha oluzenzekelayo

Ukuxhasa utshintsho (idatha yemveliso kunye nokulungiswa kobubanzi bomzila) kunokunciphisa ukulahlekelwa kwexesha

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· I-ID ye-PCB yokufunda-ngohlobo lomsebenzi wokufunda-ngaphakathi we-ID wePCB ukhethwa phakathi kweentlobo ezi-3 zesikena sangaphandle, ikhamera yentloko okanye ifom yokucwangcisa.

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Ikhono lokutshintsha-Ukhetho lokuseta i-Fieder navigator

Sisixhobo senkxaso ukuhamba ngenkqubo yokuseta ngokufanelekileyo.Izixhobo zesixhobo kwinani lexesha elithathayo ukwenza kunye nokugqiba imisebenzi yokumisela xa kuqikelelwa ixesha elifunekayo kwimveliso kunye nokubonelela umqhubi imiyalelo yokumisela.Oku kuya kubona kwaye kuhlanjululwe imisebenzi yokucwangcisa ngexesha lokusekwa komgca wokuvelisa.

Ukuphuculwa kwezinga lokusebenza - Amacandelo anikezela ukhetho lomqhubi

Isixhobo senkxaso sobonelelo lwecandelo esijonga izinto eziphambili ngokubonelela ngecandelo.Iqwalasela ixesha elishiyekileyo de kuphele icandelo kunye nendlela esebenzayo yokunyakaza komsebenzisi ukuthumela imiyalelo yonikezelo lwecandelo kumsebenzisi ngamnye.Oku kuphumeza unikezelo lwecandelo olusebenzayo.

*I-PanaCIM iyadingeka ukuba ibe nabaqhubi abajongene nokubonelela ngamacandelo kwimigca emininzi yokuvelisa.

PCB ulwazi unxibelelwano umsebenzi

Ulwazi loqwalaselo lwamanqaku olwenziwe kumatshini wokuqala we-NPM emgceni lugqithiselwa koomatshini be-NPM abasezantsi. Okunokunciphisa ixesha lomjikelo kusetyenziswa ulwazi olukhutshelweyo.

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Inkqubo yokuDala iDatha – NPM-DGS (Imodeli No.NM-EJS9A)

Le yiphakheji yesoftware ebonelela ngolawulo oludibeneyo lwelayibrari yecandelo kunye nedatha yePCB, kunye nedatha yemveliso eyandisa imigca yokunyuka kunye nokusebenza okuphezulu kunye ne-algorithms yokuphucula.

*1:Ikhompyutha kufuneka ithengwe ngokwahlukeneyo.*2:NPM-DGS inemisebenzi emibini yolawulo yomgangatho kunye nomgangatho womgca.

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CAD yokungenisa

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Ikuvumela ukuba ungenise idatha yeCAD kwaye ujonge i-polarity, njl., kwisikrini.

Ukuphucula

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Iqonda imveliso ephezulu kwaye ikuvumela ukuba wenze uluhlu oluqhelekileyo.

Umhleli wePPD

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Hlaziya idatha yokuvelisa kwi-PC ngexesha lokuvelisa ukunciphisa ukulahlekelwa kwexesha.

Ithala leencwadi

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Ivumela ulawulo olumanyeneyo lwecandelo lethala leencwadi elibandakanya ukunyuswa, ukuhlolwa kunye nokuhanjiswa.

Inkqubo yokuDala iDatha-Ikhamera eNgasebenzanga (ukhetho)

Idatha yecandelo inokudalwa ngaphandle kweintanethi nangona umatshini usebenza.

Sebenzisa ikhamera yomgca ukwenza idatha yecandelo.Iimeko zokukhanyisa kunye nesantya sokuqaphela sinokuqinisekiswa kwangaphambili, ngoko kunegalelo ekuphuculeni imveliso kunye nomgangatho.

40 Iyunithi yeKhamera engaxhunyiwe kwi-intanethi

Inkqubo yokuDala iDatha-DGS Automation (ukhetho)

Imisebenzi yesiqhelo eyenziwa ngesandla inciphisa iimpazamo zokusebenza kunye nexesha lokudala idatha.

Ngokusebenzisana kunye nenkqubo yabathengi, imisebenzi yesiqhelo yokudala idatha inokuncitshiswa, ngoko igalelo ekunciphiseni kakhulu ixesha lokulungiselela imveliso. Kwakhona kubandakanya umsebenzi ukulungisa ngokuzenzekelayo ulungelelwaniso kunye ne-angle ye indawo yokunyuka (Virtual AOI).

Umzekelo womfanekiso wenkqubo yonke

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Imisebenzi ezenzekelayo (isicatshulwa)

·CAD yokungenisa

·Useto lwamanqaku e-Offset

·PCB chamfering

·Ulungiso lolungelelwaniso lwendawo yokunyuka

·Ukudala imisebenzi

·Ukuphucula

·Imveliso yePPD

·Khuphela

Inkqubo yokuDala iDatha-ULungiso lokuseta (ukhetho)

Kwimveliso ebandakanya iimodeli ezininzi, ukuseta imithwalo yomsebenzi ithathelwa ingqalelo kwaye iphuculwe.

Ngaphezulu kwe-PCB enye yokwabelana ngokubekwa kwecandelo eliqhelekileyo, ukuseta ezininzi kunokufuneka ngenxa yokunqongophala kweeyunithi ze-suppy.Ukuze kuncitshiswe umthwalo ofunekayo wokuseta kwimeko enjalo, olu khetho lwahlula ii-PCBs zibe ngamaqela okubekwa kwamacandelo afanayo, khetha itafile. s) ukuseta kwaye ngaloo ndlela izenzele umsebenzi wokubekwa kwecandelo. Inegalelo ekuphuculeni ukusebenza kolungiselelo kunye nokunciphisa ixesha lokulungiselela imveliso yokwenziwa kwabathengi beentlobo ngeentlobo zeemveliso ngokwemiyinge emincinci.

Umzekelo

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Ukuphuculwa komgangatho-Umbukeli wolwazi olusemgangathweni

Le yisoftware eyilelwe ukuxhasa ukuqondwa kwamanqaku atshintshayo kunye nohlalutyo lwemiba yesiphene ngokuboniswa kolwazi olunxulumene nomgangatho (umzekelo, izikhundla ze-feeder ezisetyenzisiweyo, ukuqondwa kwamaxabiso e-offset kunye nedatha yamacandelo) nge-PCB nganye okanye indawo yokubeka.Kwimeko yentloko yethu yokuhlola yaziswa, iindawo zesiphene zingabonakaliswa ngokubambisana nolwazi olunxulumene nomgangatho.

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Umgangatho wefestile yomjongi wolwazi

Umzekelo wokusetyenziswa kombukeli wolwazi olusemgangathweni

Uchonga i-feeder esetyenziselwa ukunyuswa kweebhodi zeesekethe ezineziphene.Kwaye ukuba, umzekelo, unezinto ezininzi ezingalunganga emva kokudibanisa, izinto eziphosakeleyo zingathathwa ngokuba zibangelwa;

Iimpazamo ze-1.splicing (ukutenxa kwi-pitch kutyhilwa ngokuqatshelwa kwe-offset values)

2.utshintsho kwimilo yecandelo (iindawo ezingalunganga zereel okanye abathengisi)

Ngoko unokuthatha inyathelo elikhawulezayo kwisilungiso esingalunganga.

Inkcazo

Isazisi somzekelo

NPM-D3

Intloko yangasemva Intloko engaphambili

I-Lightweight16-nozzle intloko

Intloko ye-12-nozzle

Intloko ye-8-nozzle

Intloko ye-2-nozzle

Intloko ekhuphayo

Akukho ntloko

I-Lightweight 16-nozzle intloko

NM-EJM6D

NM-EJM6D-MD

NM-EJM6D

Intloko ye-12-nozzle

Intloko ye-8-nozzle

Intloko ye-2-nozzle

Intloko ekhuphayo

NM-EJM6D-MD

NM-EJM6D-D

Intloko yokuhlola

NM-EJM6D-MA

NM-EJM6D-A

Akukho ntloko

NM-EJM6D

NM-EJM6D-D

PCB

imilinganiselo*1(mm)

Indlela yeendlela ezimbini

L 50 x W 50 ~ L 510 x W 300

Imowudi enye

L 50 x W 50 ~ L 510 x W 590

PCBexchangetime

Iimowudi ezimbini

0 s* *Hayi 0s xa ixesha lomjikelo 3.6 s okanye ngaphantsi

Imowudi enye

3.6 s* *Xa ukhetha izihambisi ezimfutshane

Umthombo wombane

Isigaba se-3 AC 200, 220, 380, 400, 420, 480 V 2.7 kVA

Umthombo womoya *2

0.5 MPa, 100 L /min (ANR)

Imilinganiselo *2 (mm)

W 832 x D 2 652 *3 x H 1 444 *4

IMisa

I-1 680 kg (Yomzimba ongundoqo kuphela:Oku kohluka ngokuxhomekeke kuqwalaselo lokhetho.)

Intloko yokubeka

Ikhaphukhaphu 16-intloko yenozzle (intloko nganye)

Intloko yemilomo eyi-12 (intloko nganye)

8-intloko yomlomo (intloko nganye)

Intloko yemilomo emi-2 (intloko nganye)

Imowudi yemveliso ephezulu [ON]

Imo yemveliso ephezulu [OFF]

Max.isantya

42 000 cph(0.086 s/ itshiphu)

38 000 cph(0.095 s/ itshiphu)

34 500 cph(0.104 s/ itshiphu)

21 500 cph(0.167 s/ itshiphu)

5 500 cph (0.655 s/ chip)4 250 cph (0.847 s/ QFP)

Ukuchaneka kokubekwa (Cpk □1)

± 40 µm/chip

±30 μm / itshiphu (±25 μm / itshiphu*5)

± 30 μm / itshiphu

± 30 µm/chip ± 30 µm/QFP □ 12mm ukuya

□ 32mm ± 50 □ 12mm Ngaphantsiµm/QFP

± 30 µm/QFP

Imilinganiselo yecandelo

(mm)

0402 itshiphu * 6 ukuya L 6 x W 6 x T 3

03015*6*7/0402 itshiphu*6 ukuya kuL 6 x W 6 x T 3

0402 chip * 6 ukuba L 12 x W 12 x T 6.5

0402 itshiphu * 6 ukuya L 32 x W 32 x T 12

0603 chip ukuya L 100 x W 90 x T 28

Componentsupply

Ukucofa

Tape: 4/8/12/16/24/32/44/56 mm

Ukucofa

Max.68 (4, 8 mm tape, ireel encinci)

Intonga

Max.16 (Isiphakeli sentonga enye)

Itreyi

Ubuninzi.20 (ngetreyi yesondlo)

Intloko ekhuphayo

Ukukhupha amachaphaza

Zoba ukukhupha

Isantya sokuhambisa

0.16 s/chaphaza (Imeko : XY=10 mm, Z=ngaphantsi kwe-4 mm intshukumo, Akukho θ ukujikeleza)

4.25 s/icandelo (Imeko: 30 mm x 30 mm kwikona yokukhupha)*8

Ukuchaneka kwendawo yokuncamathela(Cpk □1)

± 75 μ m / ichaphaza

± 100 μ m /icandelo

Amacandelo asebenzayo

1608 chip ukuya SOP, PLCC, QFP, Isidibanisi, BGA, CSP

I-SOP, i-PLCC, i-QFP, i-Connector, i-BGA, i-CSP

Intloko yokuhlola

Intloko yokuhlola ye-2D (A)

Intloko yokuhlola ye-2D (B)

Isigqibo

18µm

9µm

Jonga ubukhulu (mm)

44.4 x 37.2

21.1 x 17.6

Inspectionb processing time

SolderInspection*9

0.35s/ ​​Jonga ubukhulu

UHlolo lweCandelo*9

0.5s/ Jonga ubukhulu

Into yokuhlola

SolderInspection *9

Icandelo leChip : 100 μm x 150 μm okanye ngaphezulu (0603 mm okanye ngaphezulu)Ipakethe yecandelo : φ150 μm okanye ngaphezulu

IChip component : 80 μm x 120 μm okanye ngaphezulu (0402 mm okanye ngaphezulu)Ipakethe yecandelo : φ120 μm okanye ngaphezulu

UHlolo lweCandelo *9

I-Square chip (0603 mm okanye ngaphezulu), i-SOP, i-QFP (i-pitch ye-0.4 mm okanye ngaphezulu), i-CSP, i-BGA, i-Aluminium electrolysis capacitor, i-Volume, i-Trimmer, i-Coil, i-Connector * 10

I-Square chip (0402 mm nangaphezulu), SOP, QFP (i-pitch ye-0.3 mm okanye ngaphezulu), i-CSP, i-BGA, i-Aluminiyam i-electrolysis capacitor, i-Volume, i-Trimmer, i-Coil, i-Connector*10

Izinto zokuhlola

SolderInspection *9

Ukugungqa, ukufiphala, ukungahambi kakuhle, imilo engaqhelekanga, ukuvala ibhulorho

UHlolo lweCandelo *9

Ulahlekile, tshintsha, ukuphaphatheka, ipolarity, uhlolo lwento yangaphandle *11

Ukuchaneka kwendawo yokuhlola *12( Cpk □1)

± 20 μm

± 10 μm

Hayi yokuhlolwa

SolderInspection *9

UHlolo lweCandelo *9

*1 :

Ngenxa yomahluko kwireferensi yokudluliselwa kwe-PCB, uxhulumaniso oluthe ngqo kunye ne-NPM (NM-EJM9B) / NPM-W (NM-EJM2D) / NPM-W2 (NM-EJM7D) i-specs yeendlela ezimbini ayinakusekwa.

*2 :

Kuphela kumzimba oyintloko

*3 :

Umyinge D uquka i-tray feeder : 2 683 mmDimension D iquka inqwelo yesondlo : 2 728 mm

*4 :

Ngaphandle kwemonitha, inqaba yomqondiso kunye nesigqubuthelo sefeni yesilingi.

*5 :

±25 μm ukhetho lwenkxaso yokubeka.(Phantsi kweemeko ezichazwe yiPanasonic)

*6 :

I-chip ye-03015/0402 mm idinga umbhobho/isondlo esithile.

* 7 :

Inkxaso yokubekwa kwetshiphu ye-03015 mm kuyakhethwa.

*8 :

Ixesha lokulinganisa ubude be-PCB le-0.5s lifakiwe.

*9 :

Intloko enye ayikwazi ukuphatha ukuhlolwa kwe-solder kunye nokuhlolwa kwecandelo ngexesha elifanayo.

*10 :

Nceda ujonge incwadana yengcaciso ngeenkcukacha.

* 11 :

Into yangaphandle iyafumaneka kumacandelo etshiphu.(Ngaphandle kwetshiphu ye-03015 mm)

* 12 :

Oku kukuchaneka kwendawo yokuhlola i-solder elinganiswa ngereferensi yethu usebenzisa i-PCB yeglasi yethu yokulinganisa indiza.Isenokuchatshazelwa lutshintsho ngesiquphe lobushushu be-ambient.

*Ukubeka ixesha lobuchule, ixesha lokuhlola kunye namaxabiso achanekileyo anokwahluka kancinane ngokuxhomekeke kwiimeko.

*Nceda ujonge incwadana eneenkcukacha malunga neenkcukacha.

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