Iimveliso
I-Panasonic Screen Printer SPD
Inkcazo
Inqanaba lokuprinta kabini eliqhubela phambili imveliso:
Ukuveliswa kwesantya esiphezulu
Ukuprintwa kwemveliso efanayo kwizigaba zangaphambili nasemva zokuprinta kwenza ukuba kudalwe umgca wemveliso ephezulu.
Nakwindlela enye esetyenziswayo kwinkqubo yeposi, ukusetyenziswa kwendlela kungaphuculwa ngokunikezela ngeebhodi zePC ukusuka kumanqanaba angaphambili nangasemva.
Utshintsho olungapheliyo
Ukulungiswa kwemveliso elandelayo kunokwenziwa ngexesha lemveliso yecala elinye, ngaloo ndlela kupheliswe ixesha lokutshintsha.
Ukuveliswa kweentlobo ezahlukeneyo zeebhodi zePC
Ukuprintwa kweemveliso ezahlukeneyo kumanqanaba angaphambili nasemva koshicilelo kunceda ukomeleza ukusetyenziswa kunye nokuthintela imfuneko yesitokhwe esiphakathi.
Umgangatho ophezulu kunye nemveliso ephezulu.Ukuqhubela phambili nokulandela ushicilelo olukumgangatho ophezulu "elilitye lembombo lomgangatho kukushicilela":
Intloko ye-Hybrid squeegee
Ngenxa yolawulo lwemoto yeentshukumo ezithe nkqo ze-squeegee ukongeza kwindlela yoshicilelo ye-uni-floating, siye safumana ukucutha ixesha lokushicilela kunye nokuthintela umoya ovalelwe kwi-solder paste.
Iyunithi yokufumanisa umthwalo
Intloko yokushicilela ifakwe kunye neyunithi yokufumanisa umthwalo ukujonga uxinzelelo lokushicilela ngexesha lokushicilela.
Ukulinganisa isixa se-solder esincanyathiselwe kwi-squeegee kuthintela ukunqongophala kwesixa se-solder kwimaski.
PCB inkxaso umsebenzi
Iipleyiti zenkxaso, ezidityaniswe kunye neereyile zokuhambisa, zixhasa kwicala elingasemva lebhodi yePC ukusuka ekupheleni ukuya ekupheleni, eqonda ukuzinzisa umgangatho wokushicilela.
Iinketho ezahlukeneyo ezonyusa umgangatho kunye nemveliso:
Iyunithi yokubonelela ngesoda ezenzekelayo (ukhetho)
Ukubonelela ngokuzenzekela (i-X-direction ehambisekayo) i-solder kwiimaski yenza ixesha elide loshicilelo oluqhubekayo.
Inkxaso yengxelo yeziphumo zohlolo (ukhetho)*
Ngokwedatha yolungiso loshicilelo olutshintshiweyo oluhlalutywe ngokuhlolwa kwe-solder paste (idatha yolungiso ye-APC), ilungisa iindawo zoshicilelo (X,Y,θ)
Ukubona ubude bestencil (ukhetho)
Iinkqubo zeLaser zinokwandisa uqhagamshelwano lweebhodi zePC ngeestencil ukuze ushicilelo oluzinzileyo lube nokubonelelwa.
Imask vacuum yenkxaso yokukhutshwa-ukukhutshwa (ukhetho)
Imaski yoshicilelo inokutshintshwa ngexesha loshicilelo kunye nokukhutshwa kwetafile yenkxaso.
Inokwenza ukureyinwa okuzinzile ngakumbi ngokususa utshintsho kunye nentonga yemaski.
*Izixhobo zokuhlola ze-3D zenye inkampani nazo zinokuqhagamshelwa.Nceda ubuze kummeli wakho weentengiso ngeenkcukacha ezithe kratya.
Inkcazo
| Isazisi somzekelo | SPD |
| Umzekelo No. | NM-EJP5A |
| PCB imilinganiselo (mm) | L 50 × W 50 ukuya ku-L 350 × W 300 |
| Ixesha lomjikelo | I-5.5 s (Kubandakanya ukuqatshelwa kwe-PCB) *1 |
| Ukuphindaphinda | ±12.5 µm (Cpk □1.33) |
| Imilinganiselo yesakhelo sekhusi (mm) | L 736 × W 736 (Ukhetho lwenkxaso yolunye ubungakanani * 2) |
| Umthombo wombane | Isigaba se-1 AC 200, 220, 230, 240 V ±10V 1.5 kVA * 3 |
| Umthombo womoya | 0.5 MPa, 60 L/min (ANR) |
| Imilinganiselo (mm) | W 1 220 × D 2 530 × H 1 444 * 4 |
| IMisa | 2 250kg*5 |
*1: Ixesha lokutshintshiselana kwePCB liyahluka ngokuxhomekeke kumatshini okwinkqubo yangaphambili kunye nenkqubo yeposi, ubungakanani bePCB, ukusetyenziswa kweyunithi yokucinezela-phantsi kwePCB njalo njalo.
*2: Ukufumana iinkcukacha zemaski, nceda ubone iinkcukacha.
*3: Kubandakanya ukuvuthela kunye nempompo yokucoca"Ukhetho"
*4: Ngaphandle kwenqaba yomqondiso kunye nepaneli yokuchukumisa.
*5: Ngaphandle kweenketho, njl.
*Amaxabiso afana nexesha lomjikelo kunye nokuchaneka kunokwahluka ngokuxhomekeke kwiimeko zokusebenza.
*Nceda ubhekiselele kwincwadana ethi ''Inkcazo' ngeenkcukacha.
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