Iimveliso
Iprinta yePanasonic yeSkrini SP70
Inkcazo
Umgangatho ophezulu kunye nemveliso ephezulu ..Ukuqhubeka nokulandela ushicilelo olukumgangatho ophezulu "nelitye lembombo lomgangatho kuprinta"
● Ukukwazi ukuzalisa okugqwesileyo kunye nemveliso ephezulu
Ukongeza kokuprinta rhoqo, ukulawulwa kwemoto yeentshukumo ze-vertical squeegee zenza ulawulo lwedijithali ngexesha lokunyuka kwe-squeegee kunye nokuqonda imveliso ephezulu.Le ntloko ithintela ukuphuphuma kwe-solder ukuya ngaphandle kwe-squeegee kunye nokuxhoma kwe-solder kubangela ukuxubana komoya.
● inkxaso yebhodi yebhodi yePC
Iimilo ze-solder ezizinzileyo zinokuprintwa kuyo yonke imiphezulu yebhodi ngenxa yokuxhasa ukuba kude kuphele imiphetho yebhodi.
Ukusebenza lula ..Ukusukela ngakumbi utshintsho ngesantya esiphezulu
● Ukukhangela inguqu
Inkqubo yokuseta umboniso inokunciphisa ixesha lokulungiselela imveliso
● Ukusebenza lula
Iimeko zokushicilela zingasetwa ngokuzenzekelayo ngokuchaza iindidi zemveliso
● Umsebenzi omnye wokuchukumisa ukutshintshwa kwe-squeegee
I-squeegees inokutshintshwa ngumsebenzi omnye wokuchukumisa
Uluhlu olubanzi lwezicelo
● Ubonelelo ngesoda oluzenzekelayo (ukhetho)
Ukuprintwa okuqhubekayo ixesha elide kunokwenzeka ngokunikezelwa kwe-solder ngokuzenzekelayo kwiistencil
● Umsebenzi wokuhlola i-Solder (ukhetho)
Ukungalungelelaniswa kakuhle, ukuvala ibhulorho, ukufiphala kunye nokuphuma kwamanzi kuhlolwa ngekhamera yokuqaphela iPCB.
● Inkxaso yengxelo yeziphumo zohlolo (ukhetho)*
Ngokwedatha yolungiso loshicilelo olutshintshiweyo oluhlalutywe ngokuhlolwa kwe-solder paste (idatha yolungiso ye-APC), ilungisa iindawo zoshicilelo (X,Y,θ)
● Ukukhutshwa kwesigqubuthelo semaski semaski (ukhetho)
Imaski yoshicilelo inokutshintshwa ngexesha loshicilelo kunye nokukhutshwa kwetafile yenkxaso.
Inokwenza ushicilelo oluzinze ngakumbi ngokususa utshintsho kunye nesigqubuthelo semaski.
●Ukubona ubude bestencil (ukhetho)
Iinkqubo zeLaser zinokwandisa uqhagamshelwano lweebhodi zePC ngeestencil ukuze ushicilelo oluzinzileyo lube nokubonelelwa.
*Izixhobo zokuhlola ze-3D zenye inkampani nazo zinokuqhagamshelwa.Nceda ubuze kummeli wakho weentengiso ngeenkcukacha ezithe kratya.
Inkcazo
| Isazisi somzekelo | SP70 |
| Umzekelo No. | NM-EJP3A |
| PCB imilinganiselo (mm) | L 50 × W 50 ukuya ku-L 510 × W 460 * 1 |
| Ixesha lomjikelo | I-6.8 s + ixesha lokushicilela ( Ubungakanani bebhodi : 510 × 460 mm) 5.2 s + ixesha lokushicilela ( Ubungakanani bebhodi : 330 × 250 mm) |
| Ukuchaneka koshicilelo | ±20µm |
| Ukuphindaphinda | ±5.0 µm |
| Imilinganiselo yesakhelo sekhusi (mm) | L 736 × W 736L 650 × W 550 , L 600 × W 550 |
| Umthombo wombane | Isigaba se-3 AC 200 V * 2 2.0 kVA * 3 |
| Umthombo womoya | 0.5 MPa, 30 L/min (ANR) |
| Imilinganiselo (mm) | W 1 680 × D 2 070 *4 × H 1 430 *5 |
| IMisa | 1 730 kg |
*1: Ubungakanani bePCB esebenzayo: max.L 580 mm x W 508 mm
*2: Iyahambelana nesigaba se-3 220 / 380 / 400 / 420 / 480 V
*3:Kubandakanya isivuthelo kunye nempompo yokufunxa
*4:Phatha idimension yangaphandle
*5:Ngaphandle kweliso kunye nenqaba yesiginali
*Amaxabiso afana nexesha lomjikelo kunye nokuchaneka kunokwahluka ngokuxhomekeke kwiimeko zokusebenza.
*Nceda ubhekisele kwincwadana ethi "Specification" ngeenkcukacha.
Iithegi ezishushu: umshicileli wescreen sepanasonic sp70, china, abavelisi, ababoneleli, ivenkile, thenga, ifektri
